Samsung is gearing up to launch its next-generation foldable smartphone, the Galaxy Z Flip 7, in the second half of 2025. Notably, this device is expected to be the first in Samsung’s foldable lineup to feature an in-house Exynos chipset, marking a departure from the company’s previous reliance on Qualcomm processors.
Key Specifications of Samsung Galaxy Z Flip 7:
| Specification | Details |
|---|---|
| Processor | Exynos 2500 |
| Manufacturing Process | Samsung’s second-generation 3nm (SF3) |
| CPU Configuration | 10-core setup: 1 high-performance core at 3.3 GHz, 2 performance cores at 2.75 GHz, 5 efficiency cores at 2.36 GHz, and 2 power-saving cores at 1.8 GHz |
| GPU | Xclipse 950, based on AMD’s RDNA architecture |
| Expected Launch | Second half of 2025 |
| Production Volume | Approximately 3 million units |
The Exynos 2500 chipset is anticipated to deliver enhanced performance and energy efficiency, thanks to its advanced 3nm manufacturing process. The integration of the Xclipse 950 GPU, leveraging AMD’s RDNA architecture, is expected to provide superior graphics performance, catering to users who engage in gaming and multimedia applications.
In addition to the Galaxy Z Flip 7, Samsung is reportedly planning to introduce a more affordable variant, the Galaxy Z Flip FE, aimed at making foldable technology accessible to a broader audience.
By incorporating its proprietary Exynos 2500 processor into the Galaxy Z Flip 7, Samsung aims to showcase its advancements in chip development and manufacturing, potentially reducing dependence on external suppliers and optimizing production costs.
